Pulsed Laser - 企業ランキング(全33社)
更新日： 集計期間:Nov 05, 2025〜Dec 02, 2025
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企業情報を表示
| 会社名 | 代表製品 | ||
|---|---|---|---|
| 製品画像・製品名・価格帯 | 概要 | 用途/実績例 | |
Picosecond pulse laser
10 million yen-50 million yen |
1064nm: 30W-100W 532nm: 30W-100W 355nm: 5W-50W 266nm: 3W Please consult us regarding the repetition frequency range and pulse energ... | Cutting and drilling of fragile materials such as transparent glass, sapphire, semiconductor wafers, and film materials like polyimide and P... | |
|
Picosecond pulse laser
10 million yen-50 million yen |
1064nm: 30W-100W 532nm: 30W-100W 355nm: 5W-50W 266nm: 3W Please consult us regarding the repetition frequency range and pulse energ... | Cutting and drilling of fragile materials such as transparent glass, sapphire, semiconductor wafers, and film materials like polyimide and P... | |
High-Power Nanosecond Pulse Laser Precision Series
10 million yen-50 million yen |
Please consult us regarding the repetition frequency range and pulse energy. We can accommodate test processing at our company or at the he... | Micro-drilling, cutting, and marking for electronic components and semiconductor materials; metal marking and surface modification. | |
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AOCジャパン
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- 代表製品
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Picosecond pulse laser
- 概要
- 1064nm: 30W-100W 532nm: 30W-100W 355nm: 5W-50W 266nm: 3W Please consult us regarding the repetition frequency range and pulse energ...
- 用途/実績例
- Cutting and drilling of fragile materials such as transparent glass, sapphire, semiconductor wafers, and film materials like polyimide and P...
Picosecond pulse laser
- 概要
- 1064nm: 30W-100W 532nm: 30W-100W 355nm: 5W-50W 266nm: 3W Please consult us regarding the repetition frequency range and pulse energ...
- 用途/実績例
- Cutting and drilling of fragile materials such as transparent glass, sapphire, semiconductor wafers, and film materials like polyimide and P...
High-Power Nanosecond Pulse Laser Precision Series
- 概要
- Please consult us regarding the repetition frequency range and pulse energy. We can accommodate test processing at our company or at the he...
- 用途/実績例
- Micro-drilling, cutting, and marking for electronic components and semiconductor materials; metal marking and surface modification.
-
AOCジャパン
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